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The Mobile World Congress  (MWC) ended a few days ago and while I didn’t attend I did get news from several companies on new memory/storage offerings announced around the event.  Flash memory is a critical element in modern smart phones and other mobile devices and both Micron and SanDisk were showing products there.

Micron introduced three new 64-layer, second-generation 3D NAND storage products using the high-speed Universal Flash Storage (UFS) 2.1 standard.  These embedded products are designed to deliver the storage capacities required for capturing 4k video, high definition photography and emerging VR and AR content creation for today and tomorrow’s smartphones.  The products also boost mobile-optimized architecture that utilizes artificial intelligence (AI) to extend battery life.

Micron Product Announcement

Micron UFS Flash Chips

The AI algorithms monitor activity and temperature to manage peak power and to minimize energy usage. The company says that this achieves a 2X power efficiency versus previous 3D NAND solutions. The products are available with capacities of 256GB, 128GB and 64GB capacities using 32GB TLC 3D NAND die. These products pack more storage cells into a smaller die area than competitor products by utilizing Micron’s CMOS under Array technology that puts device logic below the memory cells.

At the MWC Western Digital was showing its 400GB SanDisk Extreme UHS-1 microSDXCT card. Data rates on this card are 160MB/s, 50% faster than the previous SanDisk Extreme microSD cards. The card features the A2 specification to help launch and load applications at high speed.

The A2 specification is from the SD Association and refers to Application Performance Class. The Application Performance Class 2 (A2) is defined by SD Physical 6.0 specification. It makes SD memory card much higher performance than A1 performance by using functions of Command Queuing and Cache. Efficient flash memory management can be supported by Maintenance functions. Application Performance Class can be applied to UHS SDHC/SDXC Memory Card product family.

The table below describes outline of the Application Performance Class 1 (A1) and Class 2 (A2) specification including Pictograph, the minimum average of random read/write IOPS (IOPS in this case means that the number of 4KB read/write commands can be executed per second), and the minimum sustained sequential performance (MB/s). Those performance requirements are based on measurement under given conditions by the specification.

https://www.sdcard.org/developers/overview/application/index.html

SD Association Application Performance Class

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The Mobile World Congress  (MWC) ended a few days ago and while I didn’t attend I did get news from several companies on new memory/storage offerings announced around the event.  Flash memory is a critical element in modern smart phones and other mobile devices and both Micron and SanDisk were showing products there.

Micron introduced three new 64-layer, second-generation 3D NAND storage products using the high-speed Universal Flash Storage (UFS) 2.1 standard.  These embedded products are designed to deliver the storage capacities required for capturing 4k video, high definition photography and emerging VR and AR content creation for today and tomorrow’s smartphones.  The products also boost mobile-optimized architecture that utilizes artificial intelligence (AI) to extend battery life.

Micron Product Announcement

Micron UFS Flash Chips

The AI algorithms monitor activity and temperature to manage peak power and to minimize energy usage. The company says that this achieves a 2X power efficiency versus previous 3D NAND solutions. The products are available with capacities of 256GB, 128GB and 64GB capacities using 32GB TLC 3D NAND die. These products pack more storage cells into a smaller die area than competitor products by utilizing Micron’s CMOS under Array technology that puts device logic below the memory cells.

At the MWC Western Digital was showing its 400GB SanDisk Extreme UHS-1 microSDXCT card. Data rates on this card are 160MB/s, 50% faster than the previous SanDisk Extreme microSD cards. The card features the A2 specification to help launch and load applications at high speed.

The A2 specification is from the SD Association and refers to Application Performance Class. The Application Performance Class 2 (A2) is defined by SD Physical 6.0 specification. It makes SD memory card much higher performance than A1 performance by using functions of Command Queuing and Cache. Efficient flash memory management can be supported by Maintenance functions. Application Performance Class can be applied to UHS SDHC/SDXC Memory Card product family.

The table below describes outline of the Application Performance Class 1 (A1) and Class 2 (A2) specification including Pictograph, the minimum average of random read/write IOPS (IOPS in this case means that the number of 4KB read/write commands can be executed per second), and the minimum sustained sequential performance (MB/s). Those performance requirements are based on measurement under given conditions by the specification.

https://www.sdcard.org/developers/overview/application/index.html

SD Association Application Performance Class

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